scia Systems GmbH

  • Booth: 1141

Your partner for advanced thin film equipment.

scia Systems - Equipped for Precision

We are a full range supplier of advanced ion beam and plasma processing equipment. The systems are applicable for coating and etching processes in the production of microelectronics, MEMS and precision optical components, in both, high volume production as well as research and development environments.

Due to their flexible and modular design, our process systems can be configured according to customer specific requirements. Amongst others by combining several vacuum process chambers into cluster or in-line solutions. Together with our worldwide service partners, we offer comprehensive service and superior technology support.

Technology Portfolio

  • Ion Beam Trimming (IBT)
  • Ion Beam Etching and Milling (IBE/IBM)
  • Dual Ion Beam Sputtering (DIBS)
  • Plasma Enhanced Chemical Vapor Deposition (PECVD)
  • Reactive Ion Etching (RIE)
  • Magnetron Sputtering 
  • Dry Cleaning


  • scia Magna 200
    Cluster system for magnetron sputter deposition of up to 200 mm wafers. Typical applications include piezoelectric layers, optical coatings and passivation layers....

  • Features & Benefits

    • RF bias for conformity and stress control
    • Superior uniformity with rotatable substrate holder
    • Low substrate temperature with helium cooling and electrostatic chuck
    • High deposition rates with reactive sputtering in unipolar and bipolar mode


    • Temperature compensation films for TC-SAW devices
    • Piezoelectric films with excellent and defined crystal orientation
    • Optical high and low refractive coatings
    • Electrical insulating films
    • Co-sputtering of metals and alloys
  • scia Mill 200
    System for large area Ion Beam Etching and Milling of single substrates up to 200 mm. A typical application is structuring of complex multilayers of materials with very low contamination....

  • Features & Benefits

    • Etching angle adjustment with tiltable and rotatable substrate holder
    • Excellent uniformity without shaper
    • Enhanced selectivity and rate with reactive gases


    • Structuring of magnetic memory (MRAM) and sensors (GMR, TMR)
    • Milling of metals in MEMS production (Au, Ru, Ta, …)
    • Milling of multilayers from diversified metal and dielectric materials
    • RIBE or CAIBE of compound semiconductors (GaAs, GaN, InP, …)
    • Production of 3-dimensional optoelectronic microstructures
    • Ion beam smoothing for reduction of microroughness
  • scia Trim 200
    Ion beam trimming tool for localized film thickness trimming in MEMS applications. Typically used for frequency trimming in manufacturing of acousto-electrical devices and localized pole trimming of thin film heads and post-CMP processing....

  • Features & Benefits

    • Significant yield improvement
    • High precision and high throughput for low production costs
    • No edge exclusion with electrostatic chuck
    • Sub-nanometer removal with zero base etch function


    • Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
    • Thickness trimming of silicon on insulator (SOI), quartz, lithium tantalate (LT) or lithium niobate (LN) wafers
    • Film thickness error or step height correction in thin film head (TFH) manufacturing
    • Dimensional correction of MEMS structures
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