ASMPT Technology Hong Kong Limited

  • Booth: 3419

ASMPT manufactures materials and equipment for the assembly of IC, COB, COG, Power and LED products. Materials include Stamped / Etched LFs. Equipment includes: Die bonders for Epoxy, Eutectic, Solder, FlipChip and Thermosonic bonding as well as Lens Holder bonders and AutoFocus systems for CIS assembly; LED Die Sorters from wafer map and Integrated LED die testers; Wire bonders for Aluminum and Gold Wedge, Gold & CU Ball and Gold & CU Stud bumping; Encapsulation systems for ICs with both strip and Reel-Reel processing as well as Silicon Liquid Molding for LEDs; Trim/Form/Singulation systems for leadframe and Sort/Singulation systems for QFN and CSPBGA applications; Test Handlers for LED and IC singulated units (using turret handling) and for Strip and Matrix designs; Laser Mark handling systems for strip based stand alone laser marking; Solder Ball Attach and reflow systems; Dispense/Jetting Systems for Underfill/Gloptop processing; Epoxy Curing Ovens and Integrated Production Lines.

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