Welcome to the Thin Film Powerhouse.
Evatec delivers complete thin film production solutions for Advanced Packaging, Power Devices, MEMS, Wireless Technologies and Optoelectronics. Meet our market and application specialists for the latest equipment and process development news.
Choose Evatec''s CLUSTERLINE® 200 platform for the deposition of next generation AlScN piezoelectric materials enabling 5G or CLUSTERLINE® 300 for soft magnetic multilayers on 300 mm CMOS for Power Systems on Chip applications.
Within packaging applications like FOPLP and advanced IC substrate manufacturing our CLUSTERLINE® PNL platform is already production proven. Advanced degas technology, and static panel processing during etch and deposition combined with capability for handling of larger panel sizes up to 650 x 650mm makes our second generation platform the perfect choice for cost effective volume production with the lowest particle count and best panel yield.
Visit the booth to see the product video and learn why the fully automated CLUSTERLINE® RAD sputter platform is the perfct choice to meet the demanding deposition uniformities and process repeatabilities required in deposition of TCOs, DBRs and metals for Micro LED Display applications.