R&D Altanova Technology (Shanghai) Co., Ltd.
Welcome to R&D Altanova T3239 Booth.
At R&D Altanova, we specialize in advanced test interface solutions for both wafer sort and final test applications. Our solutions include advanced in-house design and simulation (SI/PI), advanced fabrication capabilities (probe cards, load board PCB’s, and MLO substrates) as well as full component and mechanical assembly.
R&D Altanova is the leading provider of full turn-key test interface solutions to many of the world’s largest integrated device manufacturers, fabless semiconductor companies and semiconductor foundries.
Advanced technology solutions for the ATE industry include fine pitch load board fabrication down to 0.2mm, probe card fabrication with coplanarity specifications as low as 12 μm, burn-in boards, as well as embedded component solutions for printed circuit boards and daughter-cards.
R&D Altanova uses a host of proprietary technologies and processes to enable its customers to test the world’s finest wafer nodes and most complex final packaged integrated circuits. In addition, our global infrastructure and advanced fabrication facilities ensure that we can deliver these solutions with industry leading cycle times.