Beijing Grish Hitech Co., Ltd.

Grish New Polishing Process: Using the new Rough and Ultrafine Polishing Liquid, the Rough Polishing can be processed after Double Side Lapping. Ultrafine Polishing only need 120mins. Finally achieving high quality surface polishing result. The polishing efficiency has been highly improved.

1 Double Side Lapping Liquid

With good cutting force, it is widely used in lapping of superhard materials.

2 Rough Polishing Liquid

The removal rate of liquid is stable,  and the consistency of polished surface is good.

3 Ultrafine Polishing Liquid

It is widely used for nanometer chemical mechanical polishing of various materials. Such as: sapphire material, silicon wafer, stainless steel, aluminum magnesium alloy, compound crystal polishing processing.

The 5G era is coming, and major mobile phone brands have tried some phone cover materials such as ceramics, glass, carbon fiber, etc., but the gloss, toughness, bending and compression resistance of metal cover materials are still sought after by most people, such as 304 stainless steel logo and 316 stainless steel mobile phone frame. But three big problems have long plagued the industry's precision polishing.

Q 1: Orange peel or pits are likely to appear on the surface during processing；

Q 2: The grain produced by the previous sandpaper cannot be completely removed;

Q 3: The polishing liquid is easy to crystallize in the polishing process, which will cause secondary scratches on the workpiece and greatly affect the final yield of the product.

GRISH new series of metal polishing liquid can completely solve these problems, improve the yield, and achieve the mirror polishing effect.

Semiconductor Composite material GaAs and InP is foundational material for Microelectronics & Photoelectron application ,InP as second general of typical Semiconductor material features high light and electro conversion efficiency, high electron Mobility, high working temperature, better anti-radiation property, widely applied in optical communication, High frequency MMW, Solar Energy battery for Outer space etc high tech industries. 5G network property High frequency & High transmitting Speed will need better working performance for RF Module, which will need the Semiconductor meterial to have higher eletron Mobility and higher temperature working property. The signal receiver and amplifier made from InP material is able to work on so high frequency above 1000GHz，meanwhile with so wide broadband, highly working stability. Therefore, in 5G era, InP will be major foundational material for RF module of terminal device and base transceiver station , the market for InP is booming up. 

GRISH new series of Semiconductor Polishing slurry  is professionally developed for back polishing of InP & GaAs  Chips.  It features high removal rate, better surface flatness (Ra, TTV, LTV), high qualification rate,  greatly  enhance the polishing efficiency and reduce the production cost.

1 AO Polishing Slurry

Widely used in InP Chip and GaAs Chip back polishing. Features better powder dispersion , Uniform spherical powder microstructure and better particle distribution. Grish AO slurry will have higher polishing efficiency and better surface flatness compared to other AO slurry.

2 CMP Polishing Liquid

It is widely used for nanometer chemical mechanical polishing of various materials. Such as: sapphire material, silicon wafer, stainless steel, aluminum magnesium alloy, compound crystal polishing processing.

3 Polishing Pad

Widely used in wafer, glass, metal and ceramic high flat processing.