POWERING PERFORMANCE in Electronic Packaging Materials
AI Technology, Inc. (AIT)
AIT (Princeton, NJ, USA) is a leading force in pioneering advanced semiconductor and microelectronic packaging materials for the last 30 years. With years of developing and providing high reliability film and paste adhesives, AIT has grown to have one of the most extensive material solutions in the industry.
In this SEMICON show, AIT will highlight the following proven innovative material solutions:
- 20 Micron Thick Electrically Conductive (C-DAF) and Thermally(T-DAF): proven unparalleled low thermal and electrical resistance bonding
- 3, 5, 10 Micron Thick Insulating DAF: High melt-flow for void-free bonding with proven high Tg with stress absorbing capability
- Wafer Processing Temporary Bonding Adhesives: Industry first thin bonding films besides spin-coating format for use in wafer processing including 3DTSV @ 350°C
- Thermal Interface Materials (TIM), substrate for metal-core printed circuit board, and other advanced electronic packaging materials with proven performance and reliability