Cycad Century Science&Technology Ltd.

Beijing, 
China
http://www.cycad-century.com
  • Booth: 4257

Welcome to CYCAD Exhibition Booth.

Beijing CYCAD Century Science and Technology Co., Ltd was founded in 1993. We mainly introduce the advanced technology and machines into China, and meanwhile provide local technology service to our customers. CYCAD's main products involve MRSI Systems fully automated, ultra-precision die bonding and epoxy dispensing systems, ESI Laser trimming & Wafer Marking equipment, Veeco (formerly SSEC) Wafer Wet processing Equipments & Parallel Seam Sealer, SCS Parylene film deposition system, Yestech AOI for die/wire bonders, Star Semiconductor test system, and other packing equipments.

Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Die Bonding; Attach Equipment
  • Die Removal Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Marking; Imprinting; Labeling Equipment
  • Plating; Electro Chemical Plating for device assembly
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Level Bonders
  • Wire Bonding Equipment
    • 202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Repair; Rework Equipment
  • Sealing; Bagging; Packing Equipment
  • Vacuum drying & out gassing Systems
  • Welding Equipment
    • 203 Equipment, Inspection & Measurement
  • Die Inspection; Die Shear
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Microscopes: Optical Microscopes
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 207 Equipment, Process
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
    • 208 Equipment, Test
  • Burn-In Accessory Systems
    • 301 Materials, Chemicals & Solids
  • Surface protection material; coatings
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