Aiscent Technologies,Inc.
Zhongshan,
Guangdong Province
China
http://www.aiscenttech.com
Booth: T3338
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laser direct image exposure equipment
PLP/SoC/SiP fanout digital exposure 1、Mapping and LDI digital exposure to Solve the die offset 2、Real-time adjustment of exposure focus to solve the warping of wafer package ...
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应用面板级封装、系统级封装、晶圆级封装的光刻设备
Categories
200 Equipment, Assembly
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
201 Equipment, Flat Panel Display
Color Pattern Processing Equipment
202 Equipment, General Use
Vision; ID; Bar Code Systems
207 Equipment, Process
Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
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Appointment Date*
Wednesday, Mar 17 2021
Thursday, Mar 18 2021
Friday, Mar 19 2021
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Wed Mar, 17
Thu Mar, 18
Fri Mar, 19
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