Semiconductor Composite material GaAs and InP is foundational material for Microelectronics & Photoelectron application ,InP as second general of typical Semiconductor material features high light and electro conversion efficiency, high electron Mobility, high working temperature, better anti-radiation property, widely applied in optical communication, High frequency MMW, Solar Energy battery for Outer space etc high tech industries. 5G network property High frequency & High transmitting Speed will need better working performance for RF Module, which will need the Semiconductor meterial to have higher eletron Mobility and higher temperature working property. The signal receiver and amplifier made from InP material is able to work on so high frequency above 1000GHz，meanwhile with so wide broadband, highly working stability. Therefore, in 5G era, InP will be major foundational material for RF module of terminal device and base transceiver station , the market for InP is booming up.
GRISH new series of Semiconductor Polishing slurry is professionally developed for back polishing of InP & GaAs Chips. It features high removal rate, better surface flatness (Ra, TTV, LTV), high qualification rate, greatly enhance the polishing efficiency and reduce the production cost.
1 AO Polishing Slurry
Widely used in InP Chip and GaAs Chip back polishing. Features better powder dispersion , Uniform spherical powder microstructure and better particle distribution. Grish AO slurry will have higher polishing efficiency and better surface flatness compared to other AO slurry.
2 CMP Polishing Liquid
It is widely used for nanometer chemical mechanical polishing of various materials. Such as: sapphire material, silicon wafer, stainless steel, aluminum magnesium alloy, compound crystal polishing processing.
3 Polishing Pad
Widely used in wafer, glass, metal and ceramic high flat processing.