1)IC Handler : SYNAX
SX2400 is the SYNAX tri-temp(Wide Temp Rate: -55 ~ 175℃) handler for mass production. It has been adopted by several major Chinese companies.We offer a variety of options to meet customer requirements, such as non-magnetic support and high pressure etc.
・Endless Operation: 72hrs guarantee
・Low Jam Rate: 1/5000
・Device Handling: 2.5x2.5 ~ 50x50mm
・Wide Temp Rate: -55 ~ 175℃
・High Contact Force: 300kgf
・Index Time: 0.9 sec.
・UPH: 4750/8ch (Cold temp)
・Interface: TTL, GPIB, RS232
・Dimension: 1590 x 1500 x 1950mm
S9+HSC is the SYNAX new model of tri-temp handler for mass production. Since the platform of the H&A handler is used, it is possible to change over easily and save time when changing the devices regardless of low or high temperature tests.
・High UPH: 16300/16ch Room temp); 8000/16ch (Cold temp)
・Device Handling: 2x2 ~ 50x50mm
・Index Time: 1.0 sec.
・Wide Temp Rate: -55 ~ 175℃
・Dimension: 2120 x 1820 x 2118mm
R4 is the SYNAX R&D handler. Due to it is simple structure, maintenance is very simple.
Equipped a camera which supports user's difficult test flows, such as P&P positioning, OCR, 2D code, and device recognition. We offer a variety of options to meet customer R&D requirement.
・Device Type: BGA, CSP, QFN, BCC, SQFP, TSOP
・Device Size: 1x1 ~ 100x100mm
・Wide Temp Rate: -80 ~ 175℃
・Test Site: Single
・Contact Force: 85kgf
・Index Time: 9.5 sec.
2)Test Scket : UNITECHNO
Unitechno's sockets can be accommodated any purpose such as Automotive, Mobile, Industrial application and so forth. The best solution shall be proposed in accordance with requested test condition such as High current, High Frequency, Non-magnetic, Reliability, BI, etc. The best custom-made sockets for any kinds of Device such as BGA, QFP, QFN, LGA, CGA, WLCSP are being supplied per special requirements from the clients. In addition, the function test related fixtures for the semiconductor are being supplied.
・Solution for high frequency function test.
・Accommodate fine pitch.
・High electrical performance by optimum design.
・Quick delivery by open tooled parts.
・Easy contact pin replacement for maintenance.
・Kelvin contact，minimum distance（8 0 u）by vertical probe.
・Accommodate 0.5mm pitch full matrix FBGA.
・Accommodate 0.3mm pitch QFN with high contact force.
・Both contact pins are electrically independent structure.
Image Sensor Sockets
・Accommodate with various direction of light source and testing method.
・Establish electrical connection to IC PKG pad balls flex cable.
・Suit to manual test and mass production with handler.
3)Flamed Wafer Prober : PFC
PCP-303N is the framed wafer prober have been developed to enable the inspection of thin wafers, diced wafers in addition to normal wafers. PFC's own technology: XY position compensation by sampling achieved high test performance. We perform automatic transfer, pre-alignment, fine alignment, and probing (inspection) of normal wafers, framesd wafers from cassettes.
・Wafer Size: 12 inch;
・Frame Ring Size: Φ400mm;
・Chip Size (max): 244 x 280mm ;
・Range of Temperature: 0 ~ 150℃
・Foot Print: 1615 x 1000mm (W x D)
・Option: Quick Loader Function (reduce 1/2 of loader/unloader time); Non-magnetic function; Extra-small-diameter VAC holes handle the chip smaller than 0.5mm.