Aiscent Technologies,Inc.

Zhongshan,  Guangdong Province 
China
http://www.aiscenttech.com
  • Booth: T3338

 Products

  • laser direct image exposure equipment
    PLP/SoC/SiP fanout digital exposure 1、Mapping and LDI digital exposure to Solve the die offset 2、Real-time adjustment of exposure focus to solve the warping of wafer package ...

    • 应用面板级封装、系统级封装、晶圆级封装的光刻设备

Categories

200 Equipment, Assembly
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
    • 201 Equipment, Flat Panel Display
  • Color Pattern Processing Equipment
    • 202 Equipment, General Use
  • Vision; ID; Bar Code Systems
    • 207 Equipment, Process
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
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