NIDEC-READ was established in 1991 in Kyoto, Japan. Registered capital reached 938 million yen. Our company name “READ” conveys our commitment to “lead” the industry as an expert in the measurement and inspection of electronic equipment with our inception of technical advances.NIDEC-READ’s main strength derives from the ability to blend a wide range of elemental technologies to the industry's highest level of performance.
NIDEC-READ's optical inspection system is a fast and accurate 3D/2D inspection, useful for bump size measurement and (RDL) pattern defect inspection solution in wafer bumping process.
Electrical test systems help find open/leak circuits on printed patterns of circuit pattern defects on PLPs or substrates that form different conductors in the inner/outer layers of the photo-mask.