Regentek (Shanghai) Ltd.
Shanghai,
China
Booth: 3186
WETCO Material Be Your Trusty Partner!
Categories
200 Equipment, Assembly
Die Bonding; Attach Equipment
Dispensing Systems
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
Marking; Imprinting; Labeling Equipment
Wafer Mount; Taping Equipment
Backgrind; Slicing; Lapping; Polishing Equipment
Ball Placement; Attach Systems
Base Loader Systems
Cleaning; Washing Equipment for Assembly & Packaging
Dicing; Sawing; Scribing; Separation Equipment
203 Equipment, Inspection & Measurement
Die Inspection; Die Shear
Wire Bonding Inspection; Test
204 Equipment, Mems
Wafer Level Bonders
207 Equipment, Process
Wafer Identification; Marking Equipment
300 Materials, Assembly
Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
Molding; Encapsulation; Potting; Resin Materials
Packages; Plastic
Solder; Solder Balls and other Soldering Materials
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Appointment Date*
Wednesday, Mar 17 2021
Thursday, Mar 18 2021
Friday, Mar 19 2021
Start Time*
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End Time*
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Wed Mar, 17
Thu Mar, 18
Fri Mar, 19
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