Rokko Electronics Co., Ltd.
We Rokko is doing
“Grinding, Thinning - Ultra Thinning <5um"
“Polish/CMP”
“Cleaning”
“Flat – Ultra Flat <1um”
“Reclaim”
“Bonding - Debonding / Support wafer ”
process service for Semiconductor Wafers.
(for SiC, Silicon, LT(LiTaO3), LN(LiNbO3) and Sapphire)
And
Sale of Dummy Wafers.