ViTrox’s NEW TH3000i 3rd generation Tray to Tray IC inspection handler is incorporated with various technological innovation advancements in inspection capabilities to handle a wide range of IC packages. It is specially designed to support both high-mix low-volume, low-mix high-volume, or mix-mode usage production operating environments.
TH3000i is equipped with ADVANCED vision inspection technology, IMPROVED illumination balance, and FASTER conversion time. With the agile and SMART mechanical design improvement, ViTrox is ready for future extension to move forward into the smart manufacturing era.
Apart from the inspection and enhancement package size range enhancement, the new handler is capable of handling multiple product range inspection. Compared with previous models, it is available to inspect WETQFN, SiP, Lid Gap, Die Crack, Inner Crack, Side Exposed Copper, etc. Additionally, this solution supports integrated color vision, 5-sided inspection, and tray swapping function for selected applications.
ViTrox always strives to offer the best innovative solution and has won numerous awards to prove its strong commitment to customer satisfaction. With state-of-the-art technology and high R&D investments, customers can use ViTrox products and services confidently knowing that these innovation breakthroughs will significantly improve product yield, enhance machine throughput, and increase ROI.