Biwin Storage Technology Limited

Shenzhen,  Guangdong 
China
http://www.biwin.com.cn/en
  • Booth: 5737

BIWIN aims at providing packaging service, SiP modules, etc.

In 2009, BIWIN established the first complete 12-inch wafer packaging plant in South China in Shenzhen, with a plant area of 11,000 m². BIWIN is equipped with advanced equipment and process capabilities, and can provide BGA (FBGA/FCBGA), LGA, QFN (DRQFN, MRQFN, FCQFN) and SiP packaging, covering communications (radio frequency chips), wireless interconnection (NB-IOT, wireless wide-area communications, in-vehicle IoT, etc.), intelligent application processors (artificial intelligence chips, mobile phones and tablet CPUs, network set-top boxes, etc.), storage chips (industrial memory chips, embedded memory chips, etc.) and other industries

The Huizhou BIWIN storage technology industry project was established in 2017. The project is a key integrated circuit project in Guangdong Province in 2018. It is committed to building a comprehensive industrial base integrating R&D, production, and packaging and testing of high-end integrated circuits in South China, and its annual output value after completion could reach RMB 8.3 billion. The production base is located in Huizhou Zhongkai Economic High-tech Zone, covering an area of 38,000 m² and a building area of 110,000 m², which can achieve a monthly production capacity of more than 80KK

Currently, BIWIN has about 820 employees, two R&D bases, and service operation teams all over the world

As the first company in South China that can provide both mass production packaging and testing and fast sample packaging services, it can provide customers with mass production packaging and testing services, 24h thinning and scribing, and 24h fast plastic sealing services. Years of hard work in the field of packaging and testing have created BIWIN's four major service advantages of "leading technology, rapid response, supply chain integration, and quality assurance". The main targets of these services include universities, research institutes, design service companies, and IC design companies

The company was awarded honors such as "Leading Enterprise in Nanshan District", "Top Ten Best Domestic Chip Manufacturers", "Enterprise with Most Investment Value", "Customs AEO Enterprise", "Tax Credit Grade A Enterprise", "Top 100 Industrial Enterprises in Nanshan District", etc.

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