Nanostep Semiconductor technology(Guang Zhou),Ltd

Shenzhen,  Guang Dong 
China
http://www.june-tech.com
  • Booth: 3739

June’s Automation Co.,Ltd is located in Shenzhen, China.As an assembly and packing equipment supplier for semiconductor industry, ourproducts include Wire Bonder, Flip Chip Bonder, BGA Assembly Line, Factory Automatic,etc. We also provide high value-added services for semiconductor andmicro-electronics industry.

Categories

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
  • Wire Bonding Equipment
    • 203 Equipment, Inspection & Measurement
  • Wire Bonding Inspection; Test
    • 300 Materials, Assembly
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
    • 700 Manufacturing Services
  • Welding; specialty welding services
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