Hexafluoro-1,3-butadiene (C4F6) is an environmentally friendly dry etching gas with low GWP, high etching rate, high selectivity and high aspect ratio, showing very high performance for critical plasma etching in semiconductor devices manufacturing.
Methyl Fluoride (CH3F) is an environmentally friendly dry etching gas with low GWP, showing very high performance in etching process of semiconductor and electronic products.
Iodotrifluoromethane (CF3I) is an environmentally friendly dry etching gas with low GWP,mainly used in front end etching process of flash memory chips manufacturing.
HFO-1336mzz(E) is a non-ozone depletion, non-flammable, low global warming potential (GWP) environmentally friendly and novel dry etching gas, mainly used in front end etching process of semiconductor.