Toray Engineering Co., Ltd.

Otsu,,  SHIGA 
  • Booth: 4707

Welcome to Toray Engineering

Toray engineering propose total solution in the semiconductor and FPD manufacturing with original manufacturing device, inspection device and analysis device.1.Wafer pattern inspection, 2.Flip chip bonder,3.Bonder for embedded packaging,4.Vacuum printing encapsulation system,5.3-D Non-Contact Surface Profiler,6.Zirconia Type Oxygen Gas Analyzer.

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