Rokko Electronics Co., Ltd.

Nishinomiya,  Hyogo 
Japan
http://www.rokkodenshi.com/
  • Booth: E4776

Overview

We Rokko is doing

“Grinding, Thinning - Ultra Thinning <5um"

Polish/CMP

“Cleaning”

 “Flat – Ultra Flat <1um

Reclaim

Bonding - Debonding / Support wafer 

process service for Semiconductor Wafers.

(for SiC, Silicon, LT(LiTaO3), LN(LiNbO3) and Sapphire)

And

Sale of Dummy Wafers.