● Up to 10000+ digital channels enabling high count multi-site test
● Ultra low power consumption—power consumption is only ~25% of competitors’—coupled with increased test stability
● 100% made in China from SW, HW, firmware and mechanical components
● 50+ NOR, NAND SLC/MLC tested on the system covering major vendors
● In-house LAES technology to optimize cross-talk among sites for higher yield
● Calibration on-line to improve test accuracy and efficiency
● Full user scenarios from dynamic burn-in, wafer sort, FT and stress test