Micro-Power Scientific (H.K.) Co. Ltd.

  • Booth: E3163

Overview

Equipments and application support provider in area: E-beam evaporation, Thin Film Coating, PEVCD/RIE/Stripping, Non-Contact Surface Metrology, Diffusion/Anneal/LPCVD, Plasma treatment, Dispensing & 3D Micro Assembly, Die attach, Flip-chip bonding, Wire Bonder, Bond tester, X-ray/CSAM inspection,  Parallel Seam Sealing, Laser/Projection Welding,  Vacuum Reflow SolderingMPCVD/Diamond deposition


  Products