Overview
Elead Tech focuses on solving the bubble problem in the advanced semiconductor packaging process, and continues to independently develop and create the application system of defoaming products. Relying on the two core technologies of heat flow and air pressure, Elead Tech creates defoaming products with multi-domain De-Void System and Wafer Vacuum lamination System as the core, and provides integrated solutions for devoiding in various manufacturing processes. It is becoming a global leader in heat flow and air pressure technology and de-voiding products.
The company cooperates with 20 years+ technical experience, integrates international teams, strengthens industrial chain cooperation, de-voiding category ecology, and helps industrial development. Headquartered in the national Jiangbei New District of Nanjing, the company cooperates with international technology exchange platform, big data, mobile test platform and global multi-point service center to provide mature defoaming category solutions for semiconductor, automobile, new energy, 5G, IoT and other industries.