Welcome to the Thin Film Powerhouse.
Overview
Evatec delivers complete thin film production solutions for Advanced Packaging, Power Devices, MEMS, Wireless Technologies and Optoelectronics. Meet our market and application specialists for the latest equipment and process development news.
Choose Evatec's CLUSTERLINE® framily of 200 and 300mm platfirms for the deposition of next generation AlScN piezoelectric materials, front and backside metallization solutions enabling power device applications on Si, SiC and GaN or for wafer level optics approaches in AR/VR applications
Within packaging applications like FOPLP and advanced IC substrate manufacturing our CLUSTERLINE® 600 platform is already production proven. Advanced degas technology, and static panel processing during etch and deposition combined with capability for handling of larger panel sizes up to 650 x 650mm makes our second generation platform the perfect choice for cost effective volume production with the lowest particle count and best panel yield.
Visit the booth to learn why the fully automated CLUSTERLINE® 200 BPM sputter platform is the perfct choice to meet the demanding deposition uniformities and process repeatabilities for thin film processes in optoelectrinics applications inlcudig MicroLED, EEL and VCSEL.