Overview
Guangdong Ada Intelligent Equipment Co., Ltd. is led by experts in the field of semiconductor packaging equipment and automation with rich R & D and industrialization experience at home and abroad to develop high-precision semiconductor die bonding machines, flip chip machines, high-density wire bonding machines, wafer-level packaging equipment, Core technology of board-level packaging equipment and MicroLED massive transfer equipment. A large number of innovative intellectual property rights and breakthrough technologies have been formed in high-accuracy and high-precision motion control, vibration reduction and elimination, high-precision optical identification, software and hardware development, and mechanical structure design. Has applied for more than 50 invention and utility model patents, covering semiconductor packaging equipment, such as high-precision semiconductor die bonding machines, flip-chip machines, high-density wire bonding machines, wafer-level packaging equipment, board-level packaging equipment, MicroLED massive transfer equipment Core technology, mechanical design, electronic module technology, optics, motion control, software copyright and other aspects.