ht tech
Jiashan,
Zhejiang
China
www.join-industry.com
Booth: E4166
Categories
200 Equipment, Assembly
Die Bonding; Attach Equipment
Die Sorter; Pick & Place; Flip Chip Placement Systems
203 Equipment, Inspection & Measurement
Defect; Particle; Bump; Contamination Detection, Review or Inspection
Die Inspection; Die Shear
Package Inspection; Lead Scanners
Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
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Appointment Date*
Thursday, Jun 29 2023
Friday, Jun 30 2023
Saturday, Jul 01 2023
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End Time*
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All
Thu Jun, 29
Fri Jun, 30
Sat Jul, 01
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