Overview
Equipments and application support provider in area: E-beam evaporation, Thin Film Coating, PEVCD/RIE/Stripping, Non-Contact Surface Metrology, Diffusion/Anneal/LPCVD, Plasma treatment, Dispensing & 3D Micro Assembly, Die attach, Flip-chip bonding, Wire Bonder, Bond tester, X-ray/CSAM inspection, Parallel Seam Sealing, Laser/Projection Welding, Vacuum Reflow Soldering，MPCVD/Diamond deposition
Products