Shibaura Mechatronics Corp.

Sakae-ku, Yokohama,  Kanagawa 
Japan
http://www.shibaura.co.jp
  • Booth: E1427

Categories

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Wafer Level Bonders
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
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