Toyobishi Corporation

Taipei,  Taiwan
https://www.pcbshop.org/tw/supplier/index.asp?SupID=809
  • Booth: E3334

Overview

TOYOBISHI has concerntrated on the packing process for many years .Our products are (1) ACCRETECH dicing blades (2) HUGLE UV/Blue tape(3)OGURA probing needle and collets(4) Mitsubishi BT resin substrate(5) Mitsubishi cable (6) FUJIKURA Ag paste (7) TOKURIKI Ag Powder .We welcome your visit to our booth.

Categories

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
  • Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
    • 300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Package Substrates; Laminate; Film based
  • Packages; Ceramic and Other High Temp Compounds
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Solder; Solder Balls and other Soldering Materials
  • Thick Film Pastes; Materials
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
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