TSE Co., Ltd.

Cheonan,  Chungnam 
Korea (South)
http://www.tse21.com
  • Booth: E4373

"Toward the Company Creating the Future Value of Technology"

Overview

As a Technoloby and Science Enabler in the field of Semiconductor Test and Display Test,TSE has developed the innovative technologies needed by its customers and has engaged in continuous research and productivity improvement activities. Founded in 1994,it has engaged as a leader in interface systems for Semiconductor Test.

  Products

  • Probe Card(HPC)
    HPC (High Performance Probe Card)...

    • > High parallelism test solution up to 2,500para

    > Pin count up to 60,000pins

    > Automatic Probe bonding

  • Load Board
    Load board is an interface board to test SOC package such as CPU, Chipset, GPU and AP. TSE is providing high speed, high performance load board to the major semiconductor customers like Intel, Samsung and AMD in worldwide....

    • > V93K 769BGA Dual Site Final Test Load Board (Picture)

    > ATE design library - V93K, T2000, Ultraflex, J750 and many more testers.

    > Accumulated PCB design know-how for 25 years and SI/PI simulation capability

    > TSE has owned PCB Fab and ass'y and test line in house.

    > TSE provides load board including stiffener frame and test socket as a turnkey solution.

  • 80um pitch TF MLO
    Fine pitch solution - C4 80um Pad (Bump) pitch. Mems Technology Thin film Stack up Process. Short delivery and Turn Key solutions for Vertical Probe card....

    • > C4 Pad Pitch : 80um

    > Thickness : 1T // 1.5T // 2.5T

    > Layer : Thinfilm 3 layer + MLO 6 layers

    > Mems Technology Thin film Stackup process

    > Short delivery than conventional MLO

    > TurnKey Solution (Design +PCB FAB+MLO FAB+Probe Card assembly)

  • Extreme Temperature TIB (Test Interface Board)
    Extreme Temperature TIB(Test Interface Board) TSE Interface board specialized in Extreme Temperature Package Test...

    • Extreme Temperature Test has been required in the Memory Test Envoironment.

    TSE has developed our own specialized Interface Board System for Extreme Temperature Pacakge Test.

    Extreme Temperature TIB(Test Interface Board)

    -. Extreme temperature Connector developed

    -. Docking Epoxy Frame Material developed

    -. Direct Cooling Interface Board developed

    > Coolant, Direct Active IC Cooling

    > Component Antioxidants

    > Temp. Reduced stabilization time

  • MEMS Vertical Probe card
    TSE can serve many types of device with MEMS technology. Mobile AP, Server, Graphic, CPU, Memory controller, ASIC, Automotive - V93K DD, U-Flex DD , T2000, J750, Catalyst and etc....

    • Integrated probe card solution

    > Electrical characteristic : High speed, Low signal loss, Cres stability

    > Mechanical performance : Wide temperature test range, Good alignment and probe mark

    > Full array pitch ≥50um, Pin count up to 40,000pins

    > After service : Global service with experienced FAE (USA, China, Taiwan, Singapore)

Categories

208 Equipment, Test
  • Handlers; Positioner Systems
  • Logic Test Systems
  • Memory Test Systems
  • Package Test Systems
  • Probe Card Maintenance and Analysis Systems
  • System on a Chip (SOC); Mixed Signal Test Systems
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