Toray Engineering Co., Ltd.

Otsu,,  SHIGA 
Japan
http://www.toray-eng.co.jp
  • Booth: 2820

Welcome to Toray Engineering

Overview

Toray engineering propose total solution in the semiconductor and FPD manufacturing with original manufacturing device, inspection device and analysis device。

  • Laser Micro Trimming System LMT-HR Series
  • Flip chip bonder
  • Slot-die Coater
  • Micro LED MassTransfer
  • Micro LED Display Manufacturing Solutions
  • INSPECTRA® Lineup
  • INSPECTRA® With PL
  • Luminescence Defect Inspection System "INSPECTRA® PL" Series for Power devices (GaN, SiC)
  • Wafer Inspection System "INSPECTRA®" FR- Series
  • Polyimide Coating Materials for Semiconductor and Electronic Components
  • Material Properties
  • Micro LED Display Structure with Toray Materials
  • Processing of parts for semiconductor manufacturing and testing equipment
  • Introduction to Ultra Precision Machining Technology
  • Introduction to TORAY Advanced Engineering Shanghai Company  & Oxygen Analyzer and Ultrasonic Probe


  Products