•Capcon Limited is a high-end equipment manufacturer focusing on the field of advanced packaging equipment. Committed to providing customers with advanced packaging technology and solutions, Capcon Limited currently owns branches in Singapore, Chinese Taiwan, the Philippines, Beijing, Suzhou, Seoul, etc. The company, with our world-recognized founding team and product technology, has won over world-famous OSAT, FAB, and IDM with our well-developed product line.
•Among Capcon’s clients are ASE, SPIL, JCET, TongFu Microelectronics, DeeTee, HT Tech, SJ Semi, Forehope Electronic, and Nepes, etc. The company has fully covered all die-bonding procedures in advanced packaging, including FOWLP(Face Up/Down), PLP, POP, MCM, EMCP, Stack Die, SIP, 2.5D/3D, FCCSP, FCBGA, etc.
•Capcon explores the semiconductor advanced packaging industry, offering high-precision products like Flip Chip Bonder, Chip on Wafer Bonder, Stack Die Bonder, Panel Level Die Bonder, Multi-Chip Die Bonder, etc., which all are the latest die bonders designed for the semiconductor back-end process.
•Capcon holds multiple self-innovated technology patents, with products featuring high precision, high speed, high steadiness, and high flexibility. The company also offers product module customization to tailor to clients’ needs, committed to the customer-centered attitude to provide comprehensive services of an enhanced product life cycle.