Develop the chips of the future with SET Flip-Chip Bonders.
Overview
SET, Smart Equipment Technology, is a world leading supplier of high accuracy Flip-Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions.
Since 1975, we have been accompanying laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, thanks to our robust and precise Flip-Chip Bonders.
With equipment installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its Flip-Chip Bonders.
Ranging from manual loading to fully automated version, they cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.