上海凯世通半导体股份有限公司

上海市,  上海市 
China
http://www.kingstonesemi.com
  • Booth: 7277

Overview

上海凯世通半导体股份有限公司成立于2009年4月,是一家以离子注入技术为核心的集成电路高端装备企业,于2018年成为上海万业企业股份有限公司(SH.600641)旗下控股子公司。公司总部位于上海浦东,在北京、合肥、无锡、上海临港等地设有子公司。公司产品包括低能大束流离子注入机、高能离子注入机、中束流离子注入机、SiC离子注入机、氢离子注入机等全系列产品,工艺覆盖逻辑、存储、功率、模拟、第三代半导体等多个应用领域,量产工艺制程覆盖至28nm。公司持续领跑国产高端离子注入机产业化应用,2020年至今累计获得集成电路装备订单超10亿元。

公司现有员工250余人,研发人员占比60%。公司聚焦集成电路离子注入机的研发创新,形成了一系列具有自主知识产权的核心技术,已获授权专利139项。公司多次承担科技专项,曾获上海市科学技术二等奖、北京市科学技术一等奖、上海市专精特新中小企业、上海市科技小巨人企业等荣誉。公司致力于成为世界一流的离子注入设备与服务提供商,为中国半导体产业提供高水平、高产能、高可靠、低成本的卓越装备。


  Products

  • Low energy high current ion implanter series
    Features: High-precision Implant angle control Particle pollution control Good production line process matching ability Broad process coverage capabilities Mainstream FAB production line mass production...

  • iStellar-500:Kingstone low-energy high-current ion implanter adopts the ‘universal platform + key technology module’research and development model, adheres to the original design concept, and condenses many years of engineering experience. It has high beam transfer efficiency and an energy range of 0.2-60/80keV.
    iStellar-500C: Kingstone low-energy high-current ultra-low-temperature ion implanter, based on the iStellar-500 beam system, has low failure rate, high reliability, and achieves -100 ° ultra-low temperature implantation.
    iStellar-500S: Kingstone low-energy high-current heavy metal ion implanter, based on iStellar-500 beam system, has low failure rate, high stability, heavy metal pollution ≤1.0E10 atoms/cm2
  • High energy ion implanter series
    Features: High-precision Implant angle control Particle pollution control Metal contamination control Localized and independent supply of parts...

  • iStellar-HE2000 : Kingstone high-energy ion implanter adopts the ‘universal platform + key technology module’ research and development model, covering the 28nm process node, high-pressure acceleration, high implant angle accuracy, nano-scale particle pollution control and other key technologies to meet the needs of chip manufacturing high-energy ion implantation, with high reliability, low cost, optional customized services, suitable for logic, storage, and power device applications in integrated circuits .
    4.5/7.5MeV ultra-high energy ion implanter: Kingstone’s new generation of ultra-high energy ion implanter is used in deep well doping processes such as logic and memory chips, power devices, and CIS . It configures different energies to meet different needs of customers and is highly efficient. Features include reliable, high-precision implant control, high beam uniformity, low metal and particle contamination.

  • Hydrogen ion implanter series
    Features: High-precision Implant angle control Wide adjustable energy range Flexible switching of elements Localized and independent supply of parts...

  • iStellar-550H: Kingstone medium and high-energy hydrogen ion implanter adopts the ‘universal platform + key technology module’ research and development model, uses high-purity energy, innovatively designed measurement devices, real-time monitoring, and has high reliability.
    Megavoltage-class hydrogen high-energy machine: The megavoltage-class hydrogen high-energy machine independently developed by Kingstone starts with the ability of hydrogen ions and helium ions to produce stable high current, adopts an IC equipment transmission system platform and is strictly controllable with an energy up to 1.5MeV.
  • SiC/Medium energy high current ion implanter
    Features: High-precision Implant angle control Particle pollution control Metal contamination control Hot Implant process can reach 600℃ Localized and independent supply of parts...

  • iKing 200: The iKing 200 high current ion implantere independently developed by Kingstone uses a DC accelerator,a horizontal beam scanning process, and an advanced IHC ion source + evaporator.The P+ Implant current intensity can reach 25mA.
    iKing 360: The iKing 360 medium-current ion implanter independently developed by Kingstone uses a DC accelerator, a horizontal beam scanning process, and an advanced ELS2 ion source + evaporator. The AL+ Implant current intensity can reach 1500 euA.