Shenyang Heyan Technology Co.,Ltd

Shenyang HeYan Technology Co., Ltd. was established in 2011, is specializing in the R&D, manufacturing, consulting, and sales of semiconductor-dedicated equipment, accessor machines and consumables. The company has been awarded with national-level "small giant" enterprise, high-tech enterprise and Liaoning province gazelle enterprise.

As a professional manufacturer of wafer grinder and dicing saw, the product line mainly covers HG series precision wafer grinder, DS series precision dicing saw, JS series automatic dicing, inspection and sorting-in-one tapeless saw and other semiconductor special equipment.We focus on the precision dicing process and the grinding processing of silicon wafers, glass, ceramics, gallium arsenide, lithium niobate, metal and other hard brittle materials, which are mainly applied inintegrated circuits, optoelectronic devices, power discrete, sensors, LED, optical, refrigeration, optical communication, telecommunication, medical and other industries.

The company HQ is based in Shenyang city, has established Suzhou Heyan precision technology Co.,Ltd in 2021, with our sales and service centers spread domestic in Nanjing, Suzhou, Nantong, Zibo, Chengdu, Xiamen, Xi'an, Nanchang ,Dongguan and offices establishing overseas.Customer's demand is the strong driving force of the company's development, our goal is to provide innovative products suitable for the market, provide reasonable technical solutions, efficient and attentive after-sales service so to be your reliable business partners !