Shibaura Mechatronics Corp.
Sakae-ku, Yokohama,
Kanagawa
Japan
http://www.shibaura.co.jp
Booth: 7575
Categories
200 Equipment, Assembly
Die Bonding; Attach Equipment
Die Sorter; Pick & Place; Flip Chip Placement Systems
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
Wafer Level Bonders
207 Equipment, Process
Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
Etching; Stripping; Ashing - Dry and Wet Equipment
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Appointment Date*
Wednesday, Mar 20 2024
Thursday, Mar 21 2024
Friday, Mar 22 2024
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All
Wed Mar, 20
Thu Mar, 21
Fri Mar, 22
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