Teltec Semiconductor Pacific Limited

Hong Kong,  China
http://www.teltec.asia
  • Booth: 3331

Welcome to TELTEC Pacific‘s booth - N3.3331

Overview

Teltec Semiconductor Pacific Ltd (www.teltec.asia) is a leading Sales & Service Organization serving the Semiconductor Industry (Front & Backend) for almost 40 years.

Applications:

1) Substrate Activation/Cleaning: UVO Cleaners, Plasma Cleaning Systems

2) Failure Analysis: Bond Testers, Decapsulation Systems, SAM, IV Curve Tracers, TDR, X-ray Inspection Machines

3) Reliability: Burn-in & Reflow Ovens, Centrifuges, Solderability Testers

4) IC Testing: Automated Wafer Probe Stations, IC Testers & Handlers, Harddockings, Interfaces, Manipulators

5) Photolithography: Mask Aligners, Nanoimprinters, Photoresists, Solar Simulators, Wafer Bonders

6) Metrology: AFM, Optical Profilers, Nanoindentors, Thin Film Thickness or Thermal Warpage & Strain Measurement Systems, VPD & Laser Stress Metrology Systems

7) Deposition & Etching: ALD, Plasma Deposition & Etching Systems, Sputtering & Evaporation Systems

8) Production: AOI Machines, Strip Grinders, Auto Molding Systems, Die Bonders

Address: Rm. 2802 Wing On House, 71 Des Voeux Road, Central, Hong Kong
Tel: (852) 2521 4213
Email: info@teltec.asia


  Press Releases

  • (Jan 22, 2024)
  • (Jan 22, 2024)
  • (Jan 22, 2024)
  • (Jan 29, 2024)
  • (Jan 29, 2024)

  Products

  • Xinsheng Technology
    Auto-Molding Equipment...

  • Auto-Molding Equipment 自动塑封机

    STM-120

    产品应用

    1. QFN / DFN
    2. BGA / LGA
    3. FCBGA / FCLGA
    • 采用成熟技术设计,确保设备运行稳定
    • 采用模块化设计,方便组合及功能追加
    • 可搭载不同模具厂家的模具
    • 电气部品及主要零部件日本原厂生产
    • 针对不同产品的丰富可选功能
    • 现地化生产,及时的零部件供应及售后服务

    STM-180

    产品应用

    1. SOT / SOD
    2. SOP / QFP
    • 设备采用模块化设计,方便组合及功能追加
    • 可搭载不同模具厂商的模具生产
    • 电气部品及主要零部件采用日本原厂生产,保证品质
    • 针对不同产品,有丰富的可选功能
    • 设备现地化生产,及时的零部件供应及售后服务

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