Overview
Boschman is the one stop shop for highly innovative packaging solutions.
Boschman is a high-tech, solution driven Dutch company focusing on advanced packaging solutions. We provide a unique one-stop-shop concept – from idea to industrialization – offering her customers one point of contact for all packaging business. This approach ensures all processes to be carefully monitored and integrated, in order to create the most efficient and effective packaging solution and as short as possible time-to-market.
Our technologies
Silver sintering is a proven die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. It provides both high yield and high reliability. • Film Assisted Molding (FAM) Film Assisted Molding is a cluster of unique technologies using films in between the molds and the products to be encapsulated. This technology offers many advantages.
Dynamic Insert Technology:
Dynamic Insert Technology (DIT) is a patented technology that has been developed to further optimize the performance of FAM to automatically and dynamically control pressure on one or multiple surface. To keep specific areas fully exposed.
Through Polymer Via (TPV) is a patented technology to create high-density high-aspect ratio electrical and/or optical inter-connections through (transfer-molding) package encapsulation.
Products