GTA MATERIAL CO., LTD.

New Taipei City,  Taiwan
http://www.gta.com.tw
  • Booth: 3258

Overview

GTA was established in July 1993 as trading and manufacturing company focusing in the electronics industry. Over the past 10 years GTA has grown into an outstanding organization serving the Semiconductor, LCD, and SMT Industries. With locations in Asia and USA, GTA is successfully able to serve its customers and principles while continuing to look for new opportunities.

  Products

  • Clean Dice
    Surfactant additive to improve lubricity Good cooling effect during the dicing process Prolong the service life of the cutting knife Effectively improve the corrosion of wafers....

    • CleanDice is designed specifically for the semiconductor industry. It is a surfactant assistive mixed along with DI water to improve lubricity and cooling as well as removing  particles and corrosion.
  • Flux Cleaner
    Halogen-free Excellent material compatibility Mild saponification to rapidly dissolve harden flux residues Low surface tension to wetting, penetration and cleaning of flux residue Made without, nor contains any heavy metal chelators like 'E.D.T.A.'...

    • Flux Cleaner is a liquid cleaner added to water to make a non-foaming solution for removing flux residue. It is alkaline,  water based cleaner for dissolving fluxes and cleaning other board or assembly contaminants.
  • Laser Sawing Solution
    Reduce the heating and burning effects during the laser cutting process Decrease the sum up of particles stickled onto wafers Provide a coating protection for wafers Provide a debris free quality during the cutting process Fully water-soluble solution....

    • Laser Sawing Solution is designed specifically for the laser cutting process. Perfectly suitable for laser cutting that improves the lubricity while improving of coolant created by the cutting process.
  • Wafer Dicing Tape
    Stable adhesion force and reduced adhesion after 365nm UV exposure. With high modulus design, the adhesive strongly wafer in dicing and avoid chipping or burrs on cut edges....

    • The acrylic PO tape and PVC tape is suitable for application in wafer dicing process. The high modulus adhesive strongly support wafer in the dicing process and avoid chipping or burrs on cut edges. The adhesive layer shows stable adhesion at ambient condition, sensitive to UV-light, easily removable after exposure of 365nm LED without leaving adhesive residue.
  • Wafer Back-Grinding Tape
    Stable adhesion force and reduced adhesion after 365nm UV exposure. Excellent adhesion, no adhesive residue on substrate in the tape tear-off process. ...

    • The acrylic PET tape and PO tape is suitable for application in wafer back-grinding manufacture. The adhesive is composed of gradient stacking layers. The layer in contact with Si-wafer shows high adhesion, sensitive to UV-light and easily removable after exposure of 365nm LED. The buffer layer is high elastic modulus and high creep, which would eliminate the warpage of Si-wafer, encapsulate the bump of Si-wafer and preventing water infiltration.

Categories

200 Equipment, Assembly
  • Cleaning; Washing Equipment for Assembly & Packaging
    • 300 Materials, Assembly
  • Marking ink
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
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