With its profound foundation in the ultra-precision cutting, grinding and polishing equipment manufacturing industry and continuous R&D investment, Yujing has, after 25 years of dedicated research and practice, fully mastered the key core technologies of 8-inch silicon carbide multi-wire cutting and lapping and polishing equipment, and has become the only domestic manufacturer with integrated solutions for 8-inch silicon carbide cutting, lapping and polishing equipment.
YJ-SP1500A is specially designed for 4 to 8 inch silicon carbide, sapphire and other extremely hard and brittle materials. The equipment adopts a series of precision control and innovative technologies to ensure more stable results during the polishing process, aiming to achieve efficient thinning and ultimate surface polishing.Through refined polishing parameter control, it can achieve extremely high thickness tolerance control (TTV < 2μm), as well as excellent warp and bow indicators, which are better than the flatness of the original material.
Key Features:
1. The equipment meets four action modes, provides more precise trajectory control, and adapts to process requirements;
2. The upper plate adopts double airbag pressurization control to ensure stable pressurization and reduce the risk of fragmentation;
3. The upper plate adopts a swing-open structure, which is convenient for taking and placing the wafer, cleaning the machine and replacing the polishing pad;
4. The German FESTO brand air control system is equipped with imported weighing sensors to achieve real-time pressure closed-loop control, making the pressurization accuracy reach ±2.5kg.
5. The independently developed high-precision lower plate transmission system controls the end jump of the transmission body within 2 microns, ensuring that the end jump accuracy of the polishing plate is less than 10 microns.
6. The equipment has real-time temperature monitoring and closed-loop control functions to reduce disc shape changes caused by temperature changes during processing, thereby ensuring the consistency of the polished surface.