BRT6000Plus-AUTOMATIC WIRE BONDER is a planar wire bonding machine model, which can provide wire bonding solutions for the large-scale integrated circuit market. The equipment is suitable for discrete devices, ICs, LEDs, microwave components, lasers and optical communication devices. As chip size decreases and bonding density increases, higher requirements are placed on wire bonding precision and speed. The bonding accuracy of BRT6000Plus is ±2um@3sigma, and the bonding speed is faster, with a line speed of 45ms.