Suzhou Lieqi Intelligent Equipment Co., Ltd.

HS-DB3000 is a multi-functional high-speed mounting equipment for high-volume industrialized production.

It is equipped with a freely adjustable width conveyor system for seamless connection with other equipments; it is equipped with a 12-inch wafer loading system, an automatic wafer changer and an automatic nozzle changer to satisfy customers' multi-chip mounting needs.

Modular design provides flexible customization capability. Intelligent calibration and data management system enables the equipment to have the ability of process traceability and management, and at the same time, the operation is more convenient.

LQ-VADB30P is a high-precision multi-chip bonding machine optimized and developed based on its predecessor, which not only provides ±1.5um placement position accuracy, but also meets the demand for high flexibility and high efficiency. It is equipped with the following:

1, up to five pick-and-place tools

2, autofocus optic calibration system

3, 360° angular calibration system

4, simultaneous support for the dipping and dispensing process Equipped with up to five adhesive dipping tools

In high-precision mode can achieve ± 1.5um placement position accuracy (standard chip placement), while achieving a productivity of 600 UPH;

Non-precision mode can achieve ± 3um placement position accuracy (based on the product), while achieving a productivity of 1.2K UPH.

LQ-DA1201 high-speed solid crystal machine is a high-speed and high-precision die bonder for IC packaging, which combines innovative high-tech and mature technology.

The equipment supports silver paste placement and DAF process, and is compatible with LF and Substrate feed, DIE feed supports 12" wafer frame & wafer ring.

The highest placement accuracy of the equipment meets ±12.5um, UPH up to 12K.