香港电子器材有限公司

Hong Kong,  Hong Kong 
Hong Kong
http://www.teltec.asia
  • Booth: 3351

Welcome to TELTEC Pacific's booth - N3.3351

Overview

Teltec Semiconductor Pacific Ltd (www.teltec.asia)，庆祝成立41周年卓越成就，是亚太地区半导体行业（前道及后道）领先的销售与服务组织，备受业界高度推崇。

主要应用领域:
1) 基板活化/清洗：紫外臭氧清洗机、等离子去胶/清洗系统
2) 失效分析：推拉力测试仪、开封机、超声波扫描显微镜、IV曲线测试仪、TDR、X光射线检测机 
3)可靠性：老化炉及回流焊机、离心测试机、可焊性测试仪
4)IC测试：自动晶圆探针台、IC测试机及上/下料机、硬对接、接口、操控手臂
5)光刻：掩模对准器、纳米压印机、光刻胶、太阳光模拟器、晶圆键合机
6)量测：原子力显微镜，光学轮廓仪，纳米力学测试，薄膜厚度及应力量测仪，热变形外貌检测仪，XRF及XRD设备
7)沉积和蚀刻：原子层沉积机/刻蚀(ALD/ALE) 系统，等离子沉积和蚀刻系统，溅射和蒸发镀层系统
8)生产：全自动光学检测机，基板研磨减薄机，全自动注塑机，贴片机，倒装芯片键合机，多芯片键合机，植球机

联系信息：

地址: 香港中环德辅道中71号永安大厦2802室 

电话：(852) 2521 4213 

电邮：[email protected] 

  Press Releases

  • (Dec 12, 2025)
  • (Dec 12, 2025)
  • (Dec 12, 2025)
  • (Dec 12, 2025)
  • (Dec 12, 2025)

  Products

  • Sonix
    Scanning Acoustic Microscopes for Wafers and IC Packages...

    • Scanning Acoustic Microscopes for Wafers and IC Packages

  • Akrometrix
    Thermal Warpage & Strain Metrology...

    • Thermal Warpage & Strain Metrology

  • Semics
    Fully Auto Wafer Prober...

    • Fully Auto Wafer Prober

  • Techsense
    Ball Mount Machines, TCB Systems...

    • Ball Mount Machines, TCB Systems

  • Micro Control Company
    High Power Burn-In Systems...

    • High Power Burn-In Systems

產品種類

200 Equipment, Assembly
  • Ball Placement; Attach Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Molding; Encapsulation; Decapsulation Equipment
  • Wafer Level Bonders
  • Wire Bonding Equipment
    • 202 Equipment, General Use
  • Lamination; Sheet Laminating Equipment
    • 203 Equipment, Inspection & Measurement
  • Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi
  • Centrifuges
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Microscopes: Atomic Force Microscopes (AFM)
  • Microscopes: Optical Microscopes
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • Particle Monitors; Analyzers - Airborne or Liquid
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Stress; Refractive Index; Reflectivity & Conductivity Measurement
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 204 Equipment, Mems
  • Deep RIE etching; Dry Etching
  • Double sided mask aligner
  • Wafer Level Bonders
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology Tools
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Epitaxy Equipment; Epi Reactors; Molecular Beam Epitaxy (MBE); Atomic Layer Epitaxy (ALE)
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Plating; Electro Chemical Plating; Deposition Systems
  • SOI Bonders; Temporary Bonders; De-Bonders
  • Spin on Glass (SOG); on Dielectric (SOD) Track systems
    • 208 Equipment, Test
  • Burn-In Systems
  • Failure Analysis Systems
  • Handlers; Positioner Systems
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
  • System on a Chip (SOC); Mixed Signal Test Systems
  • Test Contactor Cleaning; Conditioning Systems
  • Test Head Manipulators and Docking Stations
    • 300 Materials, Assembly
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
    • 301 Materials, Chemicals & Solids
  • Photo Resist; Developers & Ancillaries (incl. Adhesion promoter (HMDS); Primer; Anti-Reflective Coat
    • 309 Materials, Test
  • Burn-In Boards; Performance Boards (incl. Low; High Temp and Ceramic)
  • Test Sockets; Contactors and Contact accessories
    • 400 Components, Parts & Accessories
  • Lamps (non Lithography), all type UV; LED and other
    • 901 Solar
  • PV Manufacturing Equipment: Inspection and Metrology
  • PV Manufacturing Equipment: Thin Film
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