ASMADE (SHENZHEN) TECHNOLOGY LIMITED, a national high-tech enterprise founded by international leading motion control expert team, gathered the industry's top packaging technology experts, focusing on the research and development of high-precision semiconductor equipment, manufacturing and sales.
The main machines are MINI LED die bonder, power device packaging equipment, advanced packaging equipment, intelligent control equipment and semiconductor packaging process management system. Dedicated to providing one-stop semiconductor packaging process die bond solutions. The machines have independent intellectual property rights.