ITEC Technologies HK Ltd

Hong Kong,  China
http://www.itecequipment.com

• Booth: 3351

Your semiconductor equipment and automation partner

Overview

High-accuracy, high-speed, high-quality semiconductor finishing processes—that’s ITEC. We combine state-of-the-art equipment and automation expertise with 30-plus years of in-company semiconductor manufacturing experience. In the presence of this strong foundation, combined with an entrepreneurial spirit and an innovative team, we are now getting ready for growth in new markets.

  Press Releases

• Unique TwinRevolve placement technique brings high-volume assembly to flip chips (Mar 20, 2026)

  Unique TwinRevolve placement technique brings high-volume assembly to flip chips

  By: Boudewijn van Blokland, Associate Director, Product Manager Die Bond 

  Flip chips are often more suitable by design than wire-bonded chips for high-performance electronic circuits. Short, thick copper pillars replace long, thin and relatively fragile wire bonds. That gives a step-change improvement in high-frequency performance, power dissipation, heat transfer, ratio of die-to-package area, and reliability. 

  Despite the benefits for low pin-count packages, flip chips have seen only limited use because flip-chip device assembly has been difficult and relatively expensive. Current Flip Chip assembly flow is to pick from wafer, flip, flux, dip and then place. That demands delicate and precise handling, so device assembly has in practice been limited to a slow 12,000 devices/hour. For smaller dies, speed is even slower because dipping the die in flux and pulling it out can only be done at a relatively slow speed. High volume manufacturers requiring over a million devices a day would need multiple machines working full time, which would need a massive investment. 

  At 60,000 devices/hour and 24/7 operation, ITEC’s ADAT3 XF TwinRevolve flip-chip die bonder can assemble over eight million devices a week. That replaces five conventional machines, making it a game changer for flip-chip assembly. It needs only a fifth of the factory floor space, with corresponding savings on maintenance, operator hours, spare parts, tool shipment and energy costs. Which means a much smaller carbon footprint, and a fraction of the Total Cost of Ownership (TCOO). 

  Rather than using the stop-start motion of conventional linear placement heads, our design uses twin synchronized rotating heads (“TwinRevolve”). Each cycle picks, flips and places chips at >16 chips a second with a controlled smooth motion to reach the 60,000/hour. The circular motion means less inertia and vibration, allowing a similar accuracy (better than 12 μm @ 3σ) as previous machines but at much higher speeds. 

  Assembling devices with up to around 100 pins, the machines allow IDMs (Integrated Device Manufacturers) and OSATs (Outsourced Semiconductor Assembly and Test) to extend their flip- chip capacity and even upgrade their high-volume wire-bonded products to a new generation. 

  Flip chips improve circuit performance

  In flip chips, the relatively thick copper pillars have a fraction of the connection resistance, parasitic capacitance and parasitic inductance of wire bonds. That improves electrical performance by reducing signal degradation and ElectroMagnetic Interference (EMI). This in turn means higher circuit speeds. 

  The virtually negligible thermal resistance of copper pillars eliminates the (small) heat loss associated with wire bonds, with better heat transfer allowing higher power dissipations: essential for high-power applications. And it eliminates wire-bond failures like broken/sagged wire, wire sweep and lifted bonds to improve reliability. 

  Eliminating the wires also increases the available package space because the length of wire from die to lead/wedge position is not needed. The higher interconnect density thus allows more silicon/functions in the same package size.

  

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