Overview
Advanced Semiconductor Bonding Technology and Solutions Provider
iSABers Group Co., Ltd. is a national high-tech enterprise at the forefront of semiconductor bonding and integration technologies in China. The company's core competencies lie in R&D and manufacturing of advanced bonding equipment and high precision bonding process solutions, with applications spanning cutting-edge domains including advanced packaging, semiconductor device fabrication, wafer-level heterogeneous integration, and MEMS sensor production.
Through its dual-drive strategy of "Equipment Manufacturing + Process Services", the company delivers end-to-end semiconductor bonding solutions. Its proprietary technology portfolio comprises four self-developed product lines with independent IP rights: Ultra-High Vacuum Room-Temperature Bonding Systems, Hybrid Bonding Equipment, Thermocompression Bonding Systems, and Customized Process Service Packages.
Driven by continuous innovation, iSABers is committed to providing high-precision, process-stable, and cost-competitive bonding technologies to the global semiconductor ecosystem, empowering strategic emerging industries such as 5G communications, AI, and new energy vehicles.