Overview
HANMI Semiconductor is a global semiconductor advanced packaging equipment company that possesses its competitive edge through a complete vertical integration system connecting the entire value chain from iron casting production, design, parts processing, software, assembly, and inspection through to distribution and sales.
The product and service offering is as follows:
1. HBM TC BONDER
2. 2.5D TC BONDER 120
3. 2.5D TC BONDER 40 C2S
4. 2.5D TC BONDER 40 C2W
5. BIG DIE FC BONDER
6. VISION PLACEMENT
7. micro SAW
8. EMI SHIELD
9. META GRINDER
10. LASER