scia Systems GmbH

Chemnitz,  Germany
http://www.scia-systems.com/
  • Booth: 5381

scia Systems - From Nano to Infinity

Overview

Founded in 2013, scia Systems is a technology leader in thin-film process equipment based on advanced ion beam and plasma technologies. The systems are used for coating, etching, and cleaning processes with nanometer resolution and have been successfully implemented in various high-tech industries worldwide, including microelectronics, MEMS, and precision optics industries.

Due to their flexible and modular design, the process equipment can be configured according to customer specific requirements, for research applications as well as high volume production in either a "cluster" or "inline" configuration. Our wide range of processing technologies includes etching processes, like Ion Beam Trimming, Ion Beam Milling and Reactive Ion Etching as well as coating processes such as Ion Beam Sputtering, PECVD and Magnetron Sputtering.

  Products

  • scia Mill 200
    System for full surface ion beam etching and milling of substrates up to 200 mm. A typical application is the structuring of complex multilayers of various materials....

    • The scia Mill 200 is designed to structure complex multilayers of various materials. Different endpoint detection systems can be equipped for exact process control. With its fully reactive gas compatibility, the system enables reactive etching processes with enhanced selectivity and rate. The flexible design of the scia Mill 200 allows it to be adapted as a single substrate version as well as in a high-volume production cluster layout with up to three process chambers and two cassette load locks. 

    Features & Benefits

    • Etching angle adjustment with a tiltable and rotatable substrate holder
    • Excellent uniformity without shaper
    • Enhanced selectivity and rate with reactive gases

    Applications

    • Structuring of magnetic memory (MRAM) and sensors (GMR, TMR, etc.)
    • Structuring of metals, piezoelectric, and dielectric materials (PZT, KNN, AlScN, InP, Cu, Pt, Au, ...), e.g., for MEMS production
    • Delayering of multilayer structures for failure analysis
    • Patterning of waveguides (LiNbO3, BTO, …) for Photonic Integrated Circuits (PIC)
    • Production of slanted surface relief gratings (SRG) for Augmented Reality
    • CAIBE of compound semiconductors (GaAs, GaN, InP, …)
    • Ion beam smoothing for reduction of microroughness
  • scia Trim 200
    Ion beam trimming system for high precision surface trimming of wafers, without limitations in film and wafer materials. They were typically used for frequency trimming in the manufacturing of acoustic-electrical devices and post-CMP processing....

    • The scia Trim 200 is used for high-precision surface trimming of wafers without film and wafer materials limitations. Designed for high-volume production, the system has a throughput and maintenance-optimized layout with a semiconductor cassette handling robot that accommodates all standard wafer sizes. In addition, a cluster configuration with two process chambers and two cassette load locks is available.

    Features & Benefits

    • Significant yield improvement
    • High precision and high throughput for low production costs
    • No edge exclusion with electrostatic chuck
    • Sub-nanometer removal with zero base etch function

    Applications

    • Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
    • Film thickness trimming of silicon on insulator (SOI) and piezo material (LT, LN) wafers
    • Dimensional correction of waveguides for photonic integrated circuits (PIC)
    • Film thickness error or step height correction in thin film head (TFH) manufacturing
    • Structuring of slanted surface relief gratings (SRG) on master stamps for imprint technologies
    • Dimensional correction of MEMS structures

Categories

202 Equipment, General Use
  • Vacuum drying & out gassing Systems
    • 204 Equipment, Mems
  • Deep RIE etching; Dry Etching
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology Tools
    • 207 Equipment, Process
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Ion; E-Beam Milling Etching Equipment
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