Attach Point Co.,LTD

Dongguan,  Guangdong Province 
China
http://www.cdapie.com
  • Booth: T3173

Welcome to APIE!

Overview

APIE is a global manufacturer of high-technology equipment specializing in advanced semiconductor packaging systems such as thermo-compression bonder (TCB) and wafer-level hybrid bonding (HB). Holders of bachelor’s, master’s, and doctoral degrees account for over 52% of our workforce. Our systems are used primarily in advanced packaging for HBM (high-bandwidth memory), high-performance CPUs/GPUs, and 2.5D/3D packaging for AI chips. Headquartered in Dongguan, we maintain branches and service teams in Singapore, the United States, Japan, Malaysia, and across Europe.

Since its establishment, APIE has consistently invested in core technologies—including motion control, precision machinery, thermo flow simulation, optical imaging, micro-nano motor, and industrial software—and has delivered a new generation of advanced packaging solutions that comprehensively cover all die-attach processes. We conduct cutting-edge research on semiconductor back-end processes, developing innovative solutions such as

Smart inline solutions for CIS-COB processes
Ultra-thin die stacking bonders
3D multi-layer stacking thermo-compression bonders (TCB).

With a mission to drive the advancement of global precision intelligent manufacturing, APIE aims to become a global leader in precision pick-and-place technology. We remain customer-focused and strive to provide innovative micro-/nano-scale, high-tech equipment for advanced semiconductor packaging.

  Products

  • AP-M3500Series Multi-Chip SiP Die Bonder
    AP-M3500 is a compact (<2 m²) multi-chip SiP die bonder delivering ±3 µm placement (3σ) and 0.07° theta control. Built for high-mix, high-throughput production with fast changeover, AMHS/SECS-GEM, and optional smart inspection....

    • Overview
    AP-M3500 is a compact (<2 m²) Multi-Chip SiP Die Bonder for advanced module manufacturing, including photonics transceivers, SiP, LiDAR and camera modules.

    Precision & Process Control
    It delivers ±3 µm XY placement accuracy (3σ) and 0.07° theta control (3σ), supported by stable BLT control and wide-range force control (0.1–10 N, ±10%) for consistent, high-yield bonding.

    Throughput & Changeover
    Built for high-mix production, AP-M3500 supports fast process change and product conversion with auto tool changing and a multi-collet bondhead for high throughput.

    Automation & Smart Factory
    Industry 4.0 ready, it supports AMHS and SECS/GEM and can integrate with OHT/AGV logistics for automated manufacturing lines.

    Quality & Reliability Options
    Optional smart inspection (post-dispense/post-bond) and FM/crack detection help improve quality, while machine health self-checking reduces unplanned downtime.

    Process & Capability Range
    Supports COB/FC/DA attach using epoxy, silver paste or UV glue, and accommodates dies from 0.15–25 mm with thickness from 0.025–7.0 mm.

    Visit Us
    Want to learn more about AP-M3500 and how it fits your production needs? Welcome to visit the APIE booth for a closer look, live discussions, and detailed technical information.

Categories

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
  • Wafer Level Bonders
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