Core Applications: O-rings, valve seats and gaskets for equipment including etching, CVD, PVD, ion implantation and cleaning machines.
Key Advantages: Resistant to HF, CF₄, nitric acid and plasma bombardment; excellent thermal stability above 300℃; low outgassing and zero contamination, ensuring wafer yield.
Consumption Features: Semiconductor-grade FFKM is a critical consumable with an average replacement cycle of 3–6 months, and shortages will directly cause production line shutdowns.